XCZU19EG-2FFVB1517I Famaritana momba ny teknolojia
AMD - XCZU19EG-2FFVB1517I Famaritana momba ny teknika, toetra, toetra, tarehimarika ary ampahany miaraka amin'ny voafaritra mitovy amin'ny AMD - XCZU19EG-2FFVB1517I
Toetran'ny vokatra | Ny sandan'ny toetra | |
---|---|---|
Manufacturer | AMD Xilinx | |
Package Device Device | 1517-FCBGA (40x40) | |
Speed | 533MHz, 600MHz, 1.3GHz | |
Series | Zynq® UltraScale+™ MPSoC EG | |
RAM Size | 256KB | |
Ireo toetra fototra | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | |
Peripherals | DMA, WDT | |
Package / Case | 1517-BBGA, FCBGA |
Toetran'ny vokatra | Ny sandan'ny toetra | |
---|---|---|
Fonosana | Tray | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Isan'ny I / O | 644 | |
Flash Size | - | |
Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | |
fifandraisana | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
Laharana vokatra fototra | XCZU19 | |
Architecture | MCU, FPGA |
TOETRA | DESCRIPTION |
---|---|
RoHs Status | |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Tonga sata | REACH Unaffected |
ECCN | 5A002A4 XIL |
HTSUS | 8542.39.0001 |
Ny lafiny telo amin'ny ankavanana dia manana fepetra manokana mitovy amin'ny AMD XCZU19EG-2FFVB1517I.
Toetran'ny vokatra | ||||
---|---|---|---|---|
Part Number | XCZU19EG-2FFVB1517I | XCZU19EG-1FFVC1760I | XCZU19EG-L1FFVC1760I | XCZU19EG-2FFVC1760E |
Manufacturer | AMD | AMD | AMD | AMD |
RAM Size | 256KB | 256KB | 256KB | 256KB |
Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
Isan'ny I / O | 644 | 512 | 512 | 512 |
fifandraisana | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Ireo toetra fototra | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Peripherals | DMA, WDT | DMA, WDT | DMA, WDT | DMA, WDT |
Series | Zynq® UltraScale+™ MPSoC EG | Zynq® UltraScale+™ MPSoC EG | Zynq® UltraScale+™ MPSoC EG | Zynq® UltraScale+™ MPSoC EG |
Package Device Device | 1517-FCBGA (40x40) | 1760-FCBGA (42.5x42.5) | 1760-FCBGA (42.5x42.5) | 1760-FCBGA (42.5x42.5) |
Architecture | MCU, FPGA | MCU, FPGA | MCU, FPGA | MCU, FPGA |
Speed | 533MHz, 600MHz, 1.3GHz | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz | 533MHz, 600MHz, 1.3GHz |
Fonosana | Tray | Tray | Tray | Tray |
Flash Size | - | - | - | - |
Laharana vokatra fototra | XCZU19 | XCZU19 | XCZU19 | XCZU19 |
Package / Case | 1517-BBGA, FCBGA | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA |
Firenena mahazatra ny fotoana lojika lojika | ||
---|---|---|
Region | Firenena | Fotoana lojika (andro) |
Amerika | Etazonia | 5 |
BREZILA | 7 | |
Eoropa | Alemaina | 5 |
fanjakana mitambatra | 4 | |
ITALIA | 5 | |
OSEANIA | AOSTRALIA | 6 |
Novely zelandy | 5 | |
AZIA | INDE | 4 |
Japana | 4 | |
Moyen Orient | Isiraely | 6 |
DHL & FedEx Fandefasana entana | |
---|---|
Fiampangana entana (kg) | Reference DHL (USD $) |
0.00kg-1.00kg | USD $ 30.00 - USD $ 60.00 |
1.00kg-2.00kg | USD $ 40.00 - USD $ 80.00 |
2.00kg-3.00kg | USD $ 50.00 - USD $ 100.00 |
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