- Jess***Jones
- 2026/04/17
Datasheets
ML610Qzzz Connection Manual.pdfLAPIS DEVELOPMENT KIT Famaritana momba ny teknolojia
Rohm Semiconductor - LAPIS DEVELOPMENT KIT Famaritana momba ny teknika, toetra, toetra, tarehimarika ary ampahany miaraka amin'ny voafaritra mitovy amin'ny Rohm Semiconductor - LAPIS DEVELOPMENT KIT
| Toetran'ny vokatra | Ny sandan'ny toetra | |
|---|---|---|
| Manufacturer | LAPIS Technology | |
| Nampiasaina IC / Part | ML610Q | |
| Type | MCU 8-Bit | |
| Soso-kevitra momba ny fandaharana fandaharana | - | |
| Series | Lapis | |
| Platform | - | |
| Fonosana | Bulk | |
| Rafitra fikirakirana | - |
| Toetran'ny vokatra | Ny sandan'ny toetra | |
|---|---|---|
| Fanamarihana | - | |
| Tendrombohitra | Fixed | |
| Interconnect System | - | |
| Core Processor | nX-U8/100 | |
| Hevitra ato Anatiny | Board(s) | |
| Board Type | Evaluation Platform | |
| Laharana vokatra fototra | ML610 |
| TOETRA | DESCRIPTION |
|---|---|
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| ECCN | EAR99 |
| HTSUS | 8471.50.0150 |
Ny lafiny telo amin'ny ankavanana dia manana fepetra manokana mitovy amin'ny Rohm Semiconductor LAPIS DEVELOPMENT KIT.
| Toetran'ny vokatra | ![]() |
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||
|---|---|---|---|---|
| Part Number | LAPIS DEVELOPMENT KIT | LAPIDEVELOPMENTKIT | LAP5-220S12W | LAP15-220D12IS |
| Manufacturer | Rohm Semiconductor | Rohm Semiconductor | SUPLET | SUPLET |
| Fanamarihana | - | - | - | - |
| Hevitra ato Anatiny | Board(s) | Board(s) | - | - |
| Rafitra fikirakirana | - | - | - | - |
| Series | Lapis | Lapis | - | - |
| Type | MCU 8-Bit | MCU 8-Bit | - | - |
| Nampiasaina IC / Part | ML610Q | ML610Q | - | - |
| Core Processor | nX-U8/100 | nX-U8/100 | - | - |
| Board Type | Evaluation Platform | Evaluation Platform | - | - |
| Interconnect System | - | - | - | - |
| Tendrombohitra | Fixed | Fixed | - | - |
| Soso-kevitra momba ny fandaharana fandaharana | - | - | - | - |
| Laharana vokatra fototra | ML610 | ML610 | - | - |
| Fonosana | Bulk | Bulk | - | - |
| Platform | - | - | - | - |
Ampidino sy LAPIS DEVELOPMENT KIT PDF Datasheets sy Rohm Semiconductor Documation ho an'ny LAPIS DEVELOPMENT KIT - Rohm Semiconductor.
LAP5-220S12WSUPLETIGBT Module
LAP15-220D12ISSUPLETIGBT Module
LAP02TA820KTaiyo YudenFIXED IND 82UH 46MA 11 OHM TH
LAP02TAR39KTaiyo YudenFIXED IND 390NH 350MA 510MOHM TH
LAP47FOSRAM
LAP02TAR27KTaiyo YudenFIXED IND 270NH 380MA 430MOHM TH
LAP02TAR82KTaiyo YudenFIXED IND 820NH 290MA 740MOHM TH
LAP02TA680KTaiyo YudenFIXED IND 68UH 64MA 7.2 OHM TH
LAP5-220S5SUPLETIGBT Module
LAP02TAR68KTaiyo YudenFIXED IND 680NH 310MA 670MOHM TH
LAP02TAR33KTaiyo YudenFIXED IND 330NH 370MA 480MOHM TH
LAP02TAR47KTaiyo YudenFIXED IND 470NH 330MA 560MOHM TH
LAP02TA8R2KTaiyo YudenFIXED IND 8.2UH 165MA 2.2 OHM TH
LAP02TAR22KTaiyo YudenFIXED IND 220NH 400MA 400MOHM TH
LAP02TAR56KTaiyo YudenFIXED IND 560NH 320MA 610MOHM TH
LAP02TA6R8KTaiyo YudenFIXED IND 6.8UH 175MA 2 OHM THTsy ho avoaka ny adiresy mailakao.
| Firenena mahazatra ny fotoana lojika lojika | ||
|---|---|---|
| Region | Firenena | Fotoana lojika (andro) |
| Amerika | Etazonia | 5 |
| BREZILA | 7 | |
| Eoropa | Alemaina | 5 |
| fanjakana mitambatra | 4 | |
| ITALIA | 5 | |
| OSEANIA | AOSTRALIA | 6 |
| Novely zelandy | 5 | |
| AZIA | INDE | 4 |
| Japana | 4 | |
| Moyen Orient | Isiraely | 6 |
| DHL & FedEx Fandefasana entana | |
|---|---|
| Fiampangana entana (kg) | Reference DHL (USD $) |
| 0.00kg-1.00kg | USD $ 30.00 - USD $ 60.00 |
| 1.00kg-2.00kg | USD $ 40.00 - USD $ 80.00 |
| 2.00kg-3.00kg | USD $ 50.00 - USD $ 100.00 |
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